JPS63145608U - - Google Patents
Info
- Publication number
- JPS63145608U JPS63145608U JP3968387U JP3968387U JPS63145608U JP S63145608 U JPS63145608 U JP S63145608U JP 3968387 U JP3968387 U JP 3968387U JP 3968387 U JP3968387 U JP 3968387U JP S63145608 U JPS63145608 U JP S63145608U
- Authority
- JP
- Japan
- Prior art keywords
- ball
- supports
- support
- breaking
- rotate freely
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3968387U JPS63145608U (en]) | 1987-03-17 | 1987-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3968387U JPS63145608U (en]) | 1987-03-17 | 1987-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145608U true JPS63145608U (en]) | 1988-09-26 |
Family
ID=30853083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3968387U Pending JPS63145608U (en]) | 1987-03-17 | 1987-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145608U (en]) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006038713A1 (en) * | 2004-10-07 | 2006-04-13 | Showa Denko K.K. | Production method for semiconductor device |
| JP2009149046A (ja) * | 2007-11-28 | 2009-07-09 | Denso Corp | 基板の製造方法 |
| JP2017152524A (ja) * | 2016-02-24 | 2017-08-31 | 株式会社ディスコ | 板状物の分割装置 |
-
1987
- 1987-03-17 JP JP3968387U patent/JPS63145608U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006038713A1 (en) * | 2004-10-07 | 2006-04-13 | Showa Denko K.K. | Production method for semiconductor device |
| JP2009149046A (ja) * | 2007-11-28 | 2009-07-09 | Denso Corp | 基板の製造方法 |
| JP2017152524A (ja) * | 2016-02-24 | 2017-08-31 | 株式会社ディスコ | 板状物の分割装置 |